March 29 - April 1, 2020
Taipei, Taiwan

Call for Participation

The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, ASICs, FPGAs, and systems-on-chip/systems-in-package. In 2020, the 29th symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field. The ACM Press will publish accepted papers in the symposium proceedings. ISPD will recognize excellent contributions through a Best Paper Award.

Topics of interest include but are not limited to:

Floorplanning and interconnect planningInteractions with system and logic level design
Partitioning, placement, and routingAnalysis and management of power dissipation
Physical design for manufacturability and yieldManagement of design data and constraints
Synthesis optimizations within physical designNew physical design methodologies
Estimation and modelingPhysical design for FPGAs
Timing and crosstalk issues in physical designCircuit analysis in a physical design context
Special structures for clocking and power networksMulti-threaded/distributed physical design algorithms
Physical design for emerging process technologiesHardware security related physical design

English and Chinese versions of the call for papers are available here:

English Simplified Chinese Traditional Chinese

Important Dates

Camera-ready paper dueJanuary 15, 2020
SymposiumMarch 29 - April 1, 2020